학술논문
'학술논문'
에서 검색결과 567건 | 목록
1~10
Academic Journal
IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 70(12):12829-12838 Dec, 2023
Academic Journal
In Microelectronics Reliability June 2022 133
Academic Journal
IEEE Access Access, IEEE. 11:97726-97734 2023
Academic Journal
In: Catalysis Today . (Catalysis Today, 1 December 2023, 424)
Academic Journal
In Microelectronics Reliability April 2018 83:162-172
Conference
Dudek, R.; Hildebrandt, M.; Kreysig, K.; Rzepka, S.; Doring, R.; Scheiter, L.; Zhang, M.; Ortmann, R. W.
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 21st International Conference on. :1-8 Jul, 2020
Conference
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 21st International Conference on. :1-6 Jul, 2020
Conference
Dudek, R.; Hildebrandt, M.; Kreysig, K.; Rzepka, S.; Doring, R.; Seiler, B.; Fries, Th.; Zhang, M.; Ortmann, R. W.
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :173-179 Dec, 2018
Conference
Dudek, R.; Doring, R.; Rzepka, S.; Herberholz, T.; Feil, D.; Seiler, B.; Scheiter, L.; Schellenberg, C.; Fritzsche, S.
2018 7th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2018 7th. :1-6 Sep, 2018
Conference
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Johrmann, N.; Pareek, K. A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M. J.; Rzepka, S.
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018 19th International Conference on. :1-13 Apr, 2018
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제한된 항목
[AR] Dudek, R.
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