학술논문

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발행년	- (예 : 2010-2015)

전체선택

Smaller Microvias for Packaging Interconnects by Picosecond UV Laser With a Nanometer Metal Barrier Layer: A Feasibility Study

Academic Journal

Liu, F.; Zhang, R.; Khurana, G.; Deprospo, B.H.; Tummala, R.R.; Swaminathan, M.

IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(8):1411-1418 Aug, 2020

Full Text (IEEE) Web of Science JCR 저널정보 Scopus Find it@PNU

Innovative Sub-5- $\mu$ m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects

Academic Journal

Liu, F.; Khurana, G.; Zhang, R.; Watanabe, A.; DeProspo, B.H.; Nair, C.; Tummala, R.R.; Swaminathan, M.

Full Text (IEEE) Web of Science JCR 저널정보 Scopus Find it@PNU

Low-Cost 1- $\mu$ m Photolithography Technologies for Large-Body-Size, Low-Resistance Panel-Based RDL

Academic Journal

Liu, F.; Nair, C.; Ito, H.; DeProspo, B.H.; Ravichandran, S.; Akimaru, H.; Hasegawa, K.; Tummala, R.R.

Full Text (IEEE) Web of Science JCR 저널정보 Scopus Find it@PNU

Heterogeneous integration for artificial intelligence: Challenges and opportunities

Academic Journal

Mukhopadhyay, S.; Yalamanchili, S.; Swaminathan, M.; Long, Y.; Mudassar, B.; Nair, C.S.; Deprospo, B.H.; Torun, H.M.; Kathaperumal, M.; Smet, V.; Kim, D.

In: IBM Journal of Research and Development. (IBM Journal of Research and Development, November-December 2019, 63(6))

Web of Science JCR 저널정보 Scopus Find it@PNU

Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics

Conference

Liu, F.; Zhang, R.; Deprospo, B.H.; Dwarakanath, S.; Nimbalkar, P.; Ravichandran, S.; Weyers, D.; Kathaperumal, M.; Tummala, R.R.; Swaminathan, M.

In: Proceedings - Electronic Components and Technology Conference, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. (Proceedings - Electronic Components and Technology Conference, June 2020, 2020-June:1132-1139)

Full Text (IEEE) Scopus Find it@PNU

Next generation of 2-7 micron ultra-small microvias for 2.5D panel redistribution layer by using laser and photolithography technologies

Conference

Liu, F.; Nair, C.; Khurana, G.; Watanabe, A.; Deprospo, B.H.; Tummala, R.R.; Kubo, A.; Lin, C.P.; Makita, T.; Watanabe, N.

In: Proceedings - Electronic Components and Technology Conference, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. (Proceedings - Electronic Components and Technology Conference, May 2019, 2019-May:924-930)

Full Text (IEEE) Scopus Find it@PNU

Low Cost Panel-Based 1-2 Micron RDL Technologies with Lower Resistance than Si BEOL for Large Packages

Conference

Liu, F.; Zhang, R.; Deprospo, B.H.; Benthaus, F.; Sundaram, V.; Tummala, R.R.; Ito, H.; Akimaru, H.; Hasegawa, K.

In: Proceedings - Electronic Components and Technology Conference, Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. (Proceedings - Electronic Components and Technology Conference, 7 August 2018, 2018-May:613-618)

Full Text (IEEE) Scopus Find it@PNU

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