학술논문

발행년
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(예 : 2010-2015)
'학술논문' 에서 검색결과 11건 | 목록 1~10
Academic Journal
In: Journal of Electronic Packaging. (Journal of Electronic Packaging, June 2022, 144(2))
Academic Journal
In: International Journal of Heat and Mass Transfer. (International Journal of Heat and Mass Transfer, February 2019, 129:152-159)
Conference
In: 2023 IEEE Energy Conversion Congress and Exposition, ECCE 2023, 2023 IEEE Energy Conversion Congress and Exposition, ECCE 2023. (2023 IEEE Energy Conversion Congress and Exposition, ECCE 2023, 2023, :4140-4146)
Academic Journal
In: Journal of Thermal Science and Engineering Applications. (Journal of Thermal Science and Engineering Applications, 1 August 2018, 10(4))
Academic Journal
In: Journal of Thermal Science and Engineering Applications. (Journal of Thermal Science and Engineering Applications, 1 December 2017, 9(4))
Conference
In: Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 2021 IEEE Applied Power Electronics Conference and Exposition, APEC 2021. (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 14 June 2021, :50-54)
Conference
In: ECCE 2020 - IEEE Energy Conversion Congress and Exposition, ECCE 2020 - IEEE Energy Conversion Congress and Exposition. (ECCE 2020 - IEEE Energy Conversion Congress and Exposition, 11 October 2020, :61-67)
Conference
In: ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020. (ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020, 2020)
Conference
In: ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020. (ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2020, 2020)
Conference
In: ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019. (ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019, 2019)
검색 결과 제한하기
제한된 항목
[AR] Cousineau, J.E.
발행연도 제한
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