학술논문
'학술논문'
에서 검색결과 154건 | 목록
1~10
Academic Journal
In International Journal of Solids and Structures 15 June 2017 117:208-220
Academic Journal
Vivet, P.; Guthmuller, E.; Thonnart, Y.; Pillonnet, G.; Fuguet, C.; Miro-Panades, I.; Moritz, G.; Durupt, J.; Bernard, C.; Varreau, D.; Pontes, J.; Thuries, S.; Coriat, D.; Harrand, M.; Dutoit, D.; Lattard, D.; Arnaud, L.; Charbonnier, J.; Coudrain, P.; Garnier, A.; Berger, F.; Gueugnot, A.; Greiner, A.; Meunier, Q.L.; Farcy, A.; Arriordaz, A.; Cheramy, S.; Clermidy, F.
IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 56(1):79-97 Jan, 2021
Academic Journal
Joblot, S.; Bar, P.; Sibuet, H.; Ferrandon, C.; Reig, B.; Jan, S.; Arnaud, C.; Lamy, Y.; Coudrain, P.; Coffy, R.; Boillon, O.; Carpentier, J.F.
In Microelectronic Engineering July 2013 107:72-79
Conference
Colonna, J. P.; Savelli, G.; Royer, A.; Coudrain, P.; Keller, M.; Manoli, Y.; Frechette, L. G.; Collin, L-M.; Billat, S.; Barrau, J
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2018 24rd International Workshop on. :1-5 Sep, 2018
Conference
Laguna, G.; Azarkish, H.; Vilarrubi, M.; Ibanez, M.; Roseli, J.; Betancourt, Y.; Illa, J.; Collin, L.-M.; Barrau, J.; Frechette, L.; Coudrain, P.; Savelli, G.
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2017 23rd International Workshop on. :1-4 Sep, 2017
Conference
Colonna, J. P.; Prieto, R.; Coudrain, P.; Hallez, Y.; Campos, D.; Le-Briz, O.; Franiatte, R.; Brunet-Manquat, C.; Chancel, C.; Rat, V.
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2017 23rd International Workshop on. :1-6 Sep, 2017
Add-On Microchannels for Hotspot Thermal Management of Microelectronic Chips in Compact Applications
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(3):434-445 Mar, 2019
Conference
Martinez, P. Y.; Beilliard, Y.; Godard, M.; Danovitch, D.; Drouin, D.; Charbonnier, J.; Coudrain, P.; Garnier, A.; Lattard, D.; Vivet, P.; Cheramy, S.; Guthmuller, E.; Tortolero, C. Fuguet; Mengue, V.; Durupt, J.; Philippe, A.; Dutoit, D.
2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020
Conference
Collin, L.-M.; Colonna, J.-P.; Coudrain, P.; Shirazy, Mahmood R. S.; Cheramy, S.; Souifi, A.; Frechette, L. G.
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 16th IEEE Intersociety Conference on. :460-464 May, 2017
Conference
Dutoit, D.; Coudrain, P.; Martinez, P.-Y.; Vivet, P.; Charbonnier, J.; Garnier, A.; Lattard, D.; Cheramy, S.; Guthmuller, E.; Philippe, A.; Thonnart, Y.; Clermidy, F.
2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :15.3.1-15.3.4 Dec, 2020
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[AR] Coudrain, P.
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