학술논문
'학술논문'
에서 검색결과 201건 | 목록
1~10
Conference
Jang, Ki-Seok; Eom, Yong-Sung; Choi, Gwang-Mun; Joo, Jiho; Shin, Jungho; Oh, Jin-Hyuk; Lee, Chan-Mi; Jung, Ji-Eun; Lee, Ga-Eun; Choi, Kwang-Seong
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th. :1-4 Sep, 2024
Academic Journal
In Journal of Materials Research and Technology January-February 2024 28:1967-1974
Reliability of Indium Solder Joints using a Laser-Assisted Bonding (LAB) Process at Room Temperature
Conference
Jung, Ji Eun; Eom, Yong-Sung; Joo, Jiho; Choi, Gwang-Mun; Shin, Jung-Ho; Lee, Chanmi; Jang, Ki-Seok; Oh, Jin-Hyuk; Lee, Ga Eun; Choi, Kwang-Seong; Lee, Seung-Yoon
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2237-2243 May, 2024
Conference
Choi, Kwang-Seong; Joo, Jiho; Choi, Gwang-Mun; Shin, Jungho; Lee, Chanmi; Jang, Ki-Seok; Oh, Jin-Hyuk; Yun, Ho-Gyeong; Moon, Seok Hwan; Jung, Ji Eun; Lee, Gaeun; Eom, Yong-Sung
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :943-948 May, 2024
Conference
Eom, Yong-Sung; Choi, Gwang-Mun; Jang, Ki-Seok; Joo, Ji-Ho; Lee, Chan-Mi; Oh, Jin-Heuk; Moon, Seok-Hwan; Choi, Kwang-Seong
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-4 Sep, 2023
Conference
Jang, Ki-Seok; Eom, Yong-Sung; Choi, Gwang-Mun; Joo, Jiho; Oh, Jin-Hyuk; Lee, Chan-Mi; Moon, Yoon-Hwan; Moon, Seok-Hwan; Choi, Kwang-Seong
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-4 Sep, 2023
Conference
Choi, Kwang-Seong; Joo, Jiho; Choi, Gwang-Mun; Lee, Chanmi; Jang, Ki-Seok; Oh, Jin-Hyuk; Shin, Jungho; Yun, Ho-Gyeong; Moon, Seok Hwan; Moon, Yoon-Hwan; Eom, Yong-Sung
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1385-1389 May, 2023
Micro-structure analysis of solder joint using room temperature Laser-Assisted Bonding (LAB) process
Conference
Moon, Yoon Hwan; Joo, Jiho; Choi, Gwang-Mun; Lee, Chanmi; Jang, Ki-Seok; Oh, Jin Hyuk; Oh, Yong-Jun; Eom, Yong-Sung; Choi, Kwang-Seong
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :01-06 May, 2023
Academic Journal
In Applied Thermal Engineering 25 March 2020 169
Academic Journal
Um, Byung Jo; Kweon, Hyungshin; Joo, Jiho; Kang, Seung‐Mo; Kim, Seungwan; Choi, Gwang‐Mun; Lee, Chanmi; Eom, Yong Sung; Choi, Kwang‐Seong; Jang, Junho; Bae, Byeong‐Soo
검색 결과 제한하기
제한된 항목
[AR] Choi, Kwang-Seong
발행연도 제한
-
학술DB(Database Provider)
저널명(출판물, Title)
출판사(Publisher)
자료유형(Source Type)
주제어
언어