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발행년	- (예 : 2010-2015)

Effects of molding pressure on the warpage and the viscoelasticities of HVQFN packages.

Academic Journal

Gui, D. Y.; Ernst, L. J.; Jansen, K. M. B.; Yang, D. G.; Goumans, L.; Bressers, H. J. L.; Janssen, J. H. J.

Journal of Applied Polymer Science; Aug2008, Vol. 109 Issue 3, p2016-2022, 7p

Full Text (Wiley Journals) Full Text (Wiley-DB) Web of Science JCR 저널정보 Scopus Find it@PNU

Micromechanical Modeling of Stress Evolution Induced During Cure in a Particle-Filled Electronic Packaging Polymer.

Academic Journal

Daoguo Yang; Jansen, K. M. B.; Wang, L. G.; Ernst, L. J.; Zhang, G. Q.; Bressers, H. J. L.; Xuejun Fan

IEEE Transactions on Components & Packaging Technologies. Dec2004, Vol. 27 Issue 4, p676-683. 8p.

Full Text (IEEE) Scopus Find it@PNU

Investigation on Flip Chip Solder Joint Fatigue With Cure-Dependent Underfill Properties.

Academic Journal

Yang, D. G.; Zhang, G. Q.; Ernst, Leo J.; Hof, Cornelis van't; Caers, J. F. J. M.; Bressers, H. J. L.; Janssen, J. H. J.

IEEE Transactions on Components & Packaging Technologies. Jun2003, Vol. 26 Issue 2, p388. 11p. 11 Black and White Photographs, 2 Diagrams, 9 Graphs.

Full Text (IEEE) Scopus Find it@PNU

Correlation between chemistry of polymer building blocks and microelectronics reliability

Academic Journal

Bressers, H. J. L.; van Driel, W. D.; Jansen, K. M. B.; Ernst, L. J.; Zhang, G. Q.

MICROELECTRONICS RELIABILITY; FEB-MAR 2007, 47 2-3, p290-p294, 5p.

Full Text (ScienceDirect 종량제) Web of Science JCR 저널정보 Scopus Find it@PNU

Numerical modeling of warpage induced in QFN array molding process

Academic Journal

Yang, D. G.; Jansen, K. M. B.; Ernst, L. J.; Zhang, G. Q.; van Driel, W. D.; Bressers, H. J. L.; Janssen, J. H. J.

MICROELECTRONICS RELIABILITY; FEB-MAR 2007, 47 2-3, p310-p318, 9p.

Full Text (ScienceDirect 종량제) Web of Science JCR 저널정보 Scopus Find it@PNU

Virtual qualification of moisture induced failures of advanced packages

Academic Journal

van Gils, M. A. J.; van Driel, W. D.; Zhang, G. Q.; Bressers, H. J. L.; van Silfhout, R. B. R.; Fan, X. J.; Janssen, J. H. J.

MICROELECTRONICS RELIABILITY; FEB-MAR 2007, 47 2-3, p273-p279, 7p.

Full Text (ScienceDirect 종량제) Web of Science JCR 저널정보 Scopus Find it@PNU

Polymer Materials Characterization, Modeling and Application.

Book

Suhir, E.; Lee, Y. C.; Wong, C. P.; Ernst, L. J.; Jansen, K. M. B.; Yang, D. G.; van 't Hof, C.; Bressers, H. J. L.; Janssen, J. H. J.; Zhang, G. Q.

Micro- & Opto-Electronic Materials & Structures: Physics, Mechanics, Design, Reliability, Packaging; 2007, pA3-A63, 1p

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Thermally and light-induced polymerization of ethyl acrylate and methyl methacrylate, studied by DSC

Academic Journal

Bressers, H. J. L.; Kloosterboer, J. G.

Polymer Bulletin. February 1980 2(3):201-204

Full Text (Springer-Archive) Web of Science JCR 저널정보 Scopus Find it@PNU

Evidence for two gel effects during the bulk polymerization of ethyl acrylate from DSC, Rayleigh and brillouin scattering

Academic Journal

Kloosterboer, J. G.; Bressers, H. J. L.

Polymer Bulletin. February 1980 2(3):205-210

Full Text (Springer-Archive) Web of Science JCR 저널정보 Scopus Find it@PNU

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