학술논문
'학술논문'
에서 검색결과 102건 | 목록
1~10
Conference
Bower, C. A.; Bonafede, S.; Raymond, B.; Pearson, A.; Prevatte, C.; Weeks, T.; Radauscher, E.; Vick, E.; Verreen, C.; Krongard, B.; Meitl, M. A.
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :175-181 Jun, 2020
Conference
Corbett, B.; Loi, R.; O'Callaghan, J.; Liu, L.; Thomas, K.; Gocalinska, A.; Pelucchi, E.; Trindade, A. J.; Bower, C. A.; Roelkens, G.; Roycroft, B.
2019 Optical Fiber Communications Conference and Exhibition (OFC) Optical Fiber Communications Conference and Exhibition (OFC), 2019. :1-3 Mar, 2019
Periodical
Meitl, M.A.; Pearson, A.; Bradshaw, G.; Keller, B.; Rinne, G.; Brown, J.; Kneeburg, D.; Meyer, C.; Knausz, I.; Trinh, B.; Radauscher, E.; Samarskiy, M.; Jain, N.; Bonafede, S.; Prevatte, C.; Yue, N.; Fisher, B.; Rivers, N.; Raymond, B.; Verreen, C.; Vick, E.; Ozbas, M.; Lynch, J.; Bower, C. A.; Nearman, N.; Hansen, R.; Wendler, B.
SID Symposium Digest of Technical Papers; June 2023, Vol. 54 Issue: 1 p398-401, 4p
Conference
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :37-42 May, 2016
Conference
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :34-34 May, 2019
Academic Journal
Meitl, M. A.; Ozbas, M.; Knausz, I.; Fox, S.; Pearson, A.; Jain, N.; Radauscher, E.; Bonafede, S.; Meyer, C.; Verreen, C.; Lynch, J.; Keller, B.; Prevatte, C.; Bower, C. A.
SID Symposium Digest of Technical Papers; Jun2022, Vol. 53 Issue 1, p644-647, 4p
Conference
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th. :1339-1343 Jun, 2010
Periodical
Meitl, M. A.; Ozbas, M.; Knausz, I.; Fox, S.; Pearson, A.; Jain, N.; Radauscher, E.; Bonafede, S.; Meyer, C.; Verreen, C.; Lynch, J.; Keller, B.; Prevatte, C.; Bower, C. A.
SID Symposium Digest of Technical Papers; June 2022, Vol. 53 Issue: 1 p644-647, 4p
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(12):1916-1922 Dec, 2011
Conference
2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :618-623 May, 2009
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제한된 항목
[AR] Bower, C. A.
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