학술논문
'학술논문'
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Academic Journal
In International Journal of Heat and Mass Transfer 1 November 2024 232
Conference
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :01-07 May, 2023
Conference
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-4 Sep, 2022
Academic Journal
Rogié, Brice; Codecasa, Lorenzo; Monier-Vinard, Eric; Bissuel, Valentin; Laraqi, Najib; Daniel, Olivier; D'Amore, Dario; Magnani, Alessandro; d'Alessandro, Vincenzo; Rinaldi, Niccolò
In Microelectronics Reliability August 2018 87:222-231
Academic Journal
In International Journal of Thermal Sciences July 2018 129:404-415
Academic Journal
Monier-Vinard, Eric; Rogié, Brice; Dia, Cheikh Tidiane; Bissuel, Valentin; Laraqi, Najib; Daniel, Olivier; Kotelon, Marie-Cécile; Fahad, Aben-Ibrahim
In Microelectronics Reliability December 2016 67:54-63
Academic Journal
In International Journal of Thermal Sciences November 2016 109:23-32
Conference
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :139-144 Jun, 2021
Academic Journal
In Solid State Electronics January 2015 103:30-39
Conference
Bissuel, Valentin; Monier-Vinard, Eric; Dupuis, Quentin; Daniel, Olivier; Laraqi, Najib; Bauzin, Jean-Gabriel
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :236-243 Jul, 2020
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제한된 항목
[AR] Bissuel, Valentin
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