학술논문
'학술논문'
에서 검색결과 116건 | 목록
1~10
Ag-3at%Cu薄膜を用いた大気中の原子拡散接合法における接合性能 / Atomic Diffusion Bonding of Wafers in Air Using Ag-3at%Cu Films
Academic Journal
エレクトロニクス実装学会誌 / Journal of The Japan Institute of Electronics Packaging. 2024, 27(1):143
Academic Journal
表面と真空 / Vacuum and Surface Science. 2022, 65(10):454
Direct Bonding of Semiconductor Chip through Elastic Resin Film / 弾性樹脂薄膜を介した半導体チップのダイレクトボンディングに関する研究
Academic Journal
Hiroshi Kikuchi; Jin Li; Miyuki Uomoto; Norimasa Nagata; Takehito Shimatsu; 島津 武仁; 李 瑾; 永田 憲雅; 菊地 広; 魚本 幸
エレクトロニクス実装学会誌 / Journal of The Japan Institute of Electronics Packaging. 2022, 25(1):133
Academic Journal
Proceedings of JIEP Annual Meeting. 2021, :17-04
Academic Journal
JSAP Annual Meetings Extended Abstracts. 2019, :3254
Academic Journal
Fumito Nakajima; Hideaki Matsuzaki; Masahiro Nada; Miyuki Uomoto; Takehito Shimatsu; yuki yamada; 中島 史人; 名田 允洋; 山田 友輝; 島津 武仁; 松崎 秀昭; 魚本 幸
JSAP Annual Meetings Extended Abstracts. 2019, :2892
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[AR] 島津 武仁
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