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Process optimization to overcome void formation in nonconductive paste interconnections for fine-pitch applications

Document Type

Journal

Author

Tan, SC; Chan, YC; Lui, NSM

Source

JOURNAL OF ELECTRONIC MATERIALS; AUG 2005, 34 8, p1143-p1149, 7p.

Subject

Language

English

ISSN

03615235

Online Access

Full Text (ProQuest Central) Full Text (Springer-Archive) Web of Science JCR 저널정보 Scopus Find it@PNU

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