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Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates

Document Type

Journal

Author

Tsai, JY; Chang, CW; Ho, CE; Lin, YL; Kao, CR

Source

JOURNAL OF ELECTRONIC MATERIALS; JAN 2006, 35 1, p65-p71, 7p.

Subject

Language

English

ISSN

1543186X

Online Access

Full Text (ECC - 개별구독 전자저널) Full Text (ProQuest Central) Full Text (Springer-Archive) Web of Science JCR 저널정보 Scopus Find it@PNU

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