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Anelastic behavior of copper thin films on silicon substrates: Damping associated with dislocations

Document Type

Journal

Author

Choi, DH; Nix, WD

Source

ACTA MATERIALIA; FEB 2006, 54 3, p679-p687, 9p.

Subject

Language

English

ISSN

13596454

Online Access

Full Text (ScienceDirect) Web of Science JCR 저널정보 Scopus Find it@PNU

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