학술논문 – 부산대학교 도서관

학술논문

replay검색결과 돌아가기

search검색화면

Impact life prediction modeling of TFBGA packages under board level drop test

Document Type

Journal

Author

Tee, TY; Ng, HS; Lim, CT; Pek, E; Zhong, ZW

Source

MICROELECTRONICS RELIABILITY; JUL 2004, 44 7, p1131-p1142, 12p.

Subject

Language

English

ISSN

00262714

Online Access

Full Text (ScienceDirect 종량제) Web of Science JCR 저널정보 Scopus Find it@PNU

이메일