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Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration With mu LED

Document Type

Journal

Author

Susumago, Yuki; Liu, Chang; Hoshi, Tadaaki; Shen, Jiayi; Shinoda, Atsushi; Kino, Hisashi; Tanaka, Tetsu; Fukushima, Takafumi

Source

IEEE ELECTRON DEVICE LETTERS; MAR 2023, 44 3, p500-p503, 4p.

Subject

Language

English

ISSN

15580563

Online Access

Full Text (IEEE) Web of Science JCR 저널정보 Scopus Find it@PNU

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