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Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires

Document Type

Journal

Author

Geissler, U; Schneider-Ramelow, M; Lang, KD; Reichl, H

Source

JOURNAL OF ELECTRONIC MATERIALS; JAN 2006, 35 1, p173-p180, 8p.

Subject

Language

English

ISSN

03615235

Online Access

Full Text (ProQuest Central) Full Text (Springer-Archive) Web of Science JCR 저널정보 Scopus Find it@PNU

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