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Failure mechanism of electromigration in via sidewall for copper dual damascene interconnection

Document Type

Journal

Author

Hsu, YL; Fang, YK; Chiang, YT; Chen, SF; Lin, CY; Chou, TH; Chang, SH

Source

JOURNAL OF THE ELECTROCHEMICAL SOCIETY; 2006, 153 8, pG782-pG786, 5p.

Subject

Language

English

ISSN

00134651

Online Access

Web of Science JCR 저널정보 Scopus Find it@PNU

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