학술논문
Quantitative comparison of electronic component-solder joint stress relief in encapsulated assemblies
Document Type
Technical Report
Author
Source
Subject
Language
English
Abstract
Component lead sleeving is the most effective method for stress relieving both component bodies and solder joints in encapsulated electronic assemblies. Silicone has been the most effective sleeving found for reducing loads; however, it compares closely to heat shrinkable polyolifin sleeving in quantitative load tests run at ambient temperatures.