학술논문

Process characterization and control of hand-soldered printed wiring assemblies
Document Type
Technical Report
Author
Source
Other Information: PBD: Sep 1993
Subject
42 ENGINEERING
36 MATERIALS SCIENCE PRINTED CIRCUITS
SOLDERING
MANUFACTURING
PARAMETRIC ANALYSIS
CLEANING
METALLURGICAL FLUX
QUALITY ASSURANCE
DEFECTS
INSPECTION 426000
COMPONENTS, ELECTRON DEVICES AND CIRCUITS
PREPARATION AND FABRICATION
Language
English
Abstract
A designed experiment was conducted to characterize the hand soldering process parameters for manufacturing printed wiring assemblies (PWAs). Component tinning was identified as the most important parameter in hand soldering. After tinning, the soldering iron tip temperature of 700{degrees}F and the choice of operators influence solder joint quality more than any other parameters. Cleaning and flux/flux core have little impact on the quality of the solder joint. The need for component cleaning prior to assembly must be evaluated for each component.