학술논문

Investigation of boron diffusion from polycrystalline silicon
Document Type
Journal Article
Author
Source
J. Electrochem. Soc.; (United States); 133:10
Subject
36 MATERIALS SCIENCE BORON
DIFFUSION
SILICON
SORPTIVE PROPERTIES
CARBON
DEPTH
DOPED MATERIALS
INTERFACES
ION IMPLANTATION
MONOCRYSTALS
OXYGEN
POLYCRYSTALS
QUANTITY RATIO
SOLUBILITY
TIME DEPENDENCE
VERY HIGH TEMPERATURE
CRYSTALS
DIMENSIONS
ELEMENTS
MATERIALS
NONMETALS
SEMIMETALS
SURFACE PROPERTIES 360602* -- Other Materials-- Structure & Phase Studies
Language
English
Abstract
The diffusion of boron from polycrystalline silicon into single crystal silicon has been measured for average boron concentrations in the polysilicon ranging from 1 X 10/sup 20/ to 7 X 10/sup 20/ atoms/cm/sup 3/. Oxygen and carbon contamination levels at the poly/single crystal silicon interface were also measured and were found to be low enough so that the boron diffusion is not affected. The boron concentration, C/sub s/ on the single crystal silicon side of the interface is independent of the diffusion time when either boron-implanted or in situ doped polysilicon is used. For highly doped polysilicon films, C/sub s/ is also independent of the boron concentration in the polysilicon and in good agreement with the boron solubility in the range from 800/sup 0/ to 1000/sup 0/C. For diffusions at 950/sup 0/C, C/sub s/ decreases slightly when the boron concentration in the polysilicon is decreased below 2.5 X 10/sup 20/ atoms cm/sup 3/. However, large changes in the boron penetration depth, x/sub j/, in the single crystal were measured for small changes in C/sub s/.