학술논문

Void Coalescence Processes Quantified through Atomistic and Multiscale Simulation
Document Type
Conference
Author
Source
14; 3; Conference: Presented at: 16th European Conference on Fracture, Alexandroupolis, Greece, Jul 03 - Jul 07, 2006
Subject
36 MATERIALS SCIENCE
42 ENGINEERING
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY ATOMS
COALESCENCE
COPPER
DEFORMATION
FRACTURES
LIGAMENTS
NUCLEATION
PLASTICS
PRECURSOR
SHAPE
SHEAR
SIMULATION
STRAIN RATE
Language
English
ISSN
0928-1045
Abstract
Simulation of ductile fracture at the atomic scale reveals many aspects of the fracture process including specific mechanisms associated with void nucleation and growth as a precursor to fracture and the plastic deformation of the material surrounding the voids and cracks. Recently we have studied void coalescence in ductile metals using large-scale atomistic and continuum simulations. Here we review that work and present some related investigations. The atomistic simulations involve three-dimensional strain-controlled multi-million atom molecular dynamics simulations of copper. The correlated growth of two voids during the coalescence process leading to fracture is investigated, both in terms of its onset and the ensuing dynamical interactions. Void interactions are quantified through the rate of reduction of the distance between the voids, through the correlated directional growth of the voids, and through correlated shape evolution of the voids. The critical inter-void ligament distance marking the onset of coalescence is shown to be approximately one void radius based on the quantification measurements used, independent of the initial separation distance between the voids and the strain-rate of the expansion of the system. No pronounced shear flow is found in the coalescence process.