학술논문

Molecular dynamics simulation of high strain-rate void nucleation and growth in copper
Document Type
Conference
Author
Source
Conference: Meeting of the topical group on shock compression of condensed matter of the American Physical Society, Amherst, MA (United States), 27 Jul - 1 Aug 1997; Other Information: PBD: 1 Jul 1997
Subject
36 MATERIALS SCIENCE COPPER
NUCLEATION
TENSILE PROPERTIES
STRAIN RATE
CRYSTAL STRUCTURE
Language
English
Abstract
Isotropic tension is simulated in nanoscale polycrystalline copper with 10 nm grain size using large-scale molecular dynamics. The nanocrystalline copper is fabricated on the computer by growing randomly oriented grains from seed sites in simulations cell. Constant volume strain rates of 10-8 to 10-10 are considered for systems ranging from 10-5 to 10-6 atoms using EAM interatomic potential for copper. The spacing between voids for room temperature single crystal simulations is found to scale approximately as l{approximately}0. 005 Cs/gamma, where Cs is the sound speed and gamma is the strain rate. Below strain rates of about 10-9, only one void is observed to nucleate and grow in the 10 nm polycrystalline simulation cell. The growth of small voids is simulated by cutting a void out of the simulation cell and repeating the isotropic expansion.