학술논문

Investigation of vibration fracture behavior of Sn–Ag–Cu solders under resonance
Document Type
Original Paper
Source
Journal of Materials Research. 19(9):2665-2673
Subject
Language
English
ISSN
0884-2914
2044-5326
Abstract
This study investigated the vibration fracture properties of Sn–Ag–Cu alloys with various Cu contents. Results show that the microstructure becomes finer with a higher Cu content. This leads to a lower damping capacity, higher deflection amplitude, and thus inferior vibration fracture resistance under a constant vibration force. It is of interest that when the Cu content reaches 1.5 wt%, the specimen possesses the highest damping capacity and greatest vibration life. The presence of massive primary Cu6Sn5 intermetallics probably accounts for this phenomenon.