부산대학교 도서관

Numerous studies have been reported on the process parametric optimization of conventional (C)-electrochemical machining (ECM). Also, some studies have been reported on modified (M)-ECM process with the use of an innovative thermoplastic slit to manage the interelectrode gap. But hitherto little has been reported on the comparison of the C/M-ECM process. This study highlights the comparison of C/M-ECM based on the mechanism for material removal rate (MRR), surface roughness (Ra), porosity (%), and other surface characteristics for Cu substrate with the Ti tool. The results are supported by scanning electron microscopy/energy-dispersive spectroscopy analysis, which justifies the increase in dissolution rate ≈100 times, MRR ≈ 10 times, 77.9% improvement in porosity (%), and 23.56% rise in Ra than C ECM. As regards the surface characteristics both C/M-ECM are acceptable as tool room processes.