부산대학교 도서관

The aim of this study was to investigate the influence of the cutting parameters on monocrystalline silicon cut by diamond wire sawing. The sawn surface was analyzed in terms of surface morphology, surface roughness, material removal mechanism and residual stress (by Raman spectroscopy). The surface morphology exhibited evidence of both material removal mechanisms: the brittle mode and the ductile mode. The surface roughness increased with a high vf, which promoted the formation of craters on the sawn surface. On applying a higher vc, the surface roughness reduced, since this favored the formation of damage-free grooves. The Raman spectrum showed evidence of different residual crystalline phases on the sawn surface, which confirms the material removal mechanisms. An increase in vf, for the same vc, caused at reduction in the compressive stress, since the brittle mode predominated as the material removal mechanism. Maintaining vf constant and increasing vc results in higher compressive stress, caused by plastic deformation of the silicon during chip formation.