학술논문
Effects of interfacial structure on the tensile behavior of 〈100〉symmetric tilt bicrystal copper
Document Type
Conference
Author
Source
한국항공우주학회 학술발표회 초록집. 2008-11 2008(11):442-444
Subject
Language
Korean
Abstract
Molecular dynamics simulations are implemented to investigate debonding behavior of symmetric tilt bicrystal interfaces with <100> misorientation axis. FCC single crystal copper is considered in each grain and the model is idealized as a grain boundary under mechanical loading. Embedded-atom method potential is chosen to calculate interatomic forces between atoms. In order to estimate the effect of misorientation angle and interface size on maximum stress and corresponding far field displacement, we apply constrained tensile deformations to interface models in a range of misorientation angles and different sizes. The results enable a deeper understanding of interface attributes into cohesive interface separation constitutive relations.