학술논문
Multi-layer thermal insulation for a bonding system
Document Type
Patent
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Abstract
A thermal insulation system is provided for a component of a bonding system, such as an optical system. The thermal insulation system comprises multiple insulation layers located between the component and a heat source. The multiple insulation layers comprise at least one layer of moving air injected into the layer and a cover layer enclosing the layer of moving air. The multiple insulation layers may further comprise a layer of static air.