학술논문
Electronic component supply device
Document Type
Patent
Author
Source
Subject
Language
Abstract
In an electronic component supply device electronic components are accommodated within cavities formed in a carrier tape of which surface is covered with a top tape. A peeling portion for peeling off the top tape from the carrier tape includes a peel-away cutout portion cut into a tape transfer direction. A thin plate has an angled portion having a rounded portion. A concavity, in which the thin plate operates, is formed in the tape pressing member downstream of the peel-away cutout portion in the tape transfer direction.