학술논문
System and method of a modular seamless haptic touchpad assembly and method of manufacture of the modular seamless haptic touchpad
Document Type
Patent
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Abstract
An apparatus and method of manufacture for a modular seamless touchpad assembly comprising a seamless glass layer extending to a plurality of palm rest surfaces formed over a touchpad support bracket that extends across a top cover of a base chassis of an information handling system and including a touchpad printed circuit board assembly (PCBA) and a haptic actuator array coupled between the touchpad PCBA and the touchpad support bracket for generating haptic user feedback. The touchpad support bracket is formed under the haptic actuator array to support the modular seamless touchpad assembly as an installable hardware module to modularly fit within a touchpad opening formed in the top cover of the base chassis and a connector port to operatively couple a haptic touchpad controller with a reciprocal connector in the touchpad opening such that the modular seamless touchpad assembly is testable via the connector port before installation.