학술논문
Semiconductor package and manufacturing method thereof
Document Type
Patent
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Abstract
A semiconductor package includes a semiconductor substrate having a semiconductor device arranged on one surface thereof; a cap substrate having one surface that opposes the one surface of the semiconductor substrate via a gap; a spacer that is arranged between the one surface of the semiconductor substrate and the one surface of the cap substrate, and that joins the semiconductor substrate and the cap substrate; and a filter that is provided on the cap substrate so as to overlap with the semiconductor device without overlapping with the spacer. The semiconductor package and method of manufacture can suppress exfoliation of the filter caused by chipping during the dicing step.