학술논문
Reflow system and method for conductive connections
Document Type
Patent
Author
Source
Subject
Language
Abstract
A system and method for forming conductive connections is disclosed. An embodiment comprises forming conductive material on to contacts of a semiconductor substrate. The semiconductor substrate is then inverter such that the conductive material is beneath the semiconductor substrate, and the conductive material is reflowed to form a conductive bump. The reflow is performed using gravity in order to form a more uniform shape for the conductive bump.