학술논문
Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
Document Type
Patent
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Abstract
A semiconductor package system, and method of manufacturing thereof, includes: an electrical substrate having a contact pad; a support structure having a lead finger thereon; a bump on the lead finger, the bump clamped on a top and a side of the lead finger and connected with the contact pad; and an encapsulant over the lead finger and the electrical substrate.