부산대학교 도서관

Thermal interface materials with high thermal conductivity are the best choice to solve the current overheating problem of electronic devices, and the choice of thermal conductive fi ller is a key factor aff ecting the performance of thermal interface composites. Hexagonal boron nitride sheet is considered to be ideal thermal conductive fi ller, but the thermal conductive eff ect of single fi ller is still insuffi cient to meet actual needs. Here, a new type of hybrid fi ller mixed with boron nitride sheet and boron phosphide particles is used to prepare epoxy based composites. When the fi ller volume fraction is 40%, the thermal conductivity of composites reaches 3.18 W m −1 K −1 . Under the same content, the thermal conductivity of the composites with mixed fi llers outperforms those with boron nitride sheet alone. At the same time, the composite material shows high breakdown strength of 46 kV mm −1 . This work provides a new way to prepare thermal interface materials with high thermal conductivity for modern electronic packaging.