부산대학교 도서관

Recently, as 3-D stacking and high integration are required in semiconductor packaging technology, it iscritical to develop higher performance packaging materials. Insulation ability and mechanical propertiesof passivation layer should be enhanced to prevent device from electrical short and malfunction. In thisstudy, low dielectric, residual stress, and the coefficient of thermal expansion polyimide/surface modifiedsilica nanoparticle composites for wafer level packaging are synthesized and investigated. Silica nanoparticlesof which surface modified with amine functional group increased the distance between polymerchains to form a free space, thereby lowering the dielectric constant. Also, they acted as a cross-linkerand showed the effect of improving the mechanical properties of polyimide. Consequently, synthesizedcomposites are potential candidate for high performance packaging material.