학술논문

Evaluating Strength of Adhesive Interface between Ceramic and Resin in Resin-Molded Structures / 樹脂モールド構造におけるセラミックスと樹脂間の接着界面強度評価
Document Type
Journal Article
Source
日本機械学会論文集A編 / TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 2011, 77(774):345
Subject
Atomic-Level Modelling
Interfacial Fracture Energy
Interfacial Strength
Resin-Molded Structure
Language
Japanese
ISSN
1884-8338
Abstract
For the stabilization of insulation performance in resin-molded insulators, strong adhesion between the resin and ceramic is required. In this paper, a new technique for the control of the interfacial strength in resin-molded structures has been proposed. The adhesive strength of the internal interface in a resin-molded structure was estimated as the interfacial fracture energy by using the molecular dynamics method. The interfacial fracture energy was qualitatively in agreement with the adhesive strength index obtained by a shear experiment. Based on the simulation results, the control of the interfacial strength was performed, and it became clear from the result that the interfacial strength between resin and ceramic can be improved up to the strength level of the glaze adhesion.