학술논문

Development of Silicon Micro Multi-edged Tool Using Anisotropic Etching (2nd Report) —Evaluation of Machining Performance for the Micro Tool and Manufacturing of Prototype Milli-sized Cutting Device— / 異方性エッチングによるシリコンマイクロ多刃工具の開発 (第2報)
Document Type
Journal Article
Source
精密工学会誌論文集 / Journal of the Japan Society for Precision Engineering, Contributed Papers. 2004, 70(10):1276
Subject
anisotropic etching
electromagnetic force
grinding
miniaturized machining device
multi-edged tool
pyramidal etch hillock
silicon fabrication
Language
Japanese
ISSN
1348-8716
1348-8724
1881-8722
Abstract
This paper describes the evaluation of machining performance for the developed micro multi-edged tool and a prototype of new cutting device by using it for plane machining. This tool is like a grinding stone and consists of micro pyramidal hillocks, which are about a few hundred nanometers tall and formed on the wet anisotropic etching in the silicon fabrication process. Though it is expected to machine aluminum alloy, glass and so on, there is a problem that is the requirement of surface contact between a material and the tool in plane machining. The developed prototype of cutting device is equipped with a new mechanism to solve this problem. In the plane machining of Al-Mg alloy by using this device, the cutting performance of micro multi-edged tool has been evaluated and it has become clear that the tool has the machining performance as well as superfinishing by using an grinding stone with superfine grains.