학술논문
Fracture Analysis of Vertical Direction Fracture in Die Attach Joint for Power Semiconductor Device / 電力半導体ダイアタッチ部の鉛直方向破壊解析
Document Type
Journal Article
Author
Source
The Proceedings of The Computational Mechanics Conference. 2019, :186
Subject
Language
Japanese
ISSN
2424-2799
Abstract
In this study, high speed temperature cycle testing was conducted using a specimen that simulated die attach structure and then mechanism of the vertical direction fracture was closely investigated. As a result, fatigue cracks started in the around of β-Sn dendrite. The growth of the damage seemed to have caused a vertical direction fracture. To reproduce of the β-Sn dendrite morphology in FEA, the percolation caster model was adopted. In the FEM model, cracks started and grew around the dendrite, which agreed with the damage found in the microstructural observation.