학술논문

BGAリフロー半田付けの最適化 / Optimization of the BGA Re-flow Soldering Process
Document Type
Journal Article
Source
品質工学 / Journal of Quality Engineering Society. 2001, 9(2):71
Subject
BGA devices
Quality Engineering
S/N ratio
Taguchi Methods
V-I characteristics
re-flow soldering
test peaces
Language
Japanese
ISSN
2189-633X
2189-9320
Abstract
In the re-flow soldering process, appearance inspection has been traditionally conducted. To improve the process, the cause and effect relationship between appearance and the process conditions are studied. With the development of high density mouting parts manufacturing technology in recent years, the appearance test can not be adopted any more. In order to use a high density mounting part for a new model, the re-flow process was reviewed and optimized without using the appearance test.