학술논문

Influences of Voltage Probe Distance on Critical Current in Copper–Stabilized REBCO Superconducting Tape with a Specifically Large Crack in Addition to Many Small Cracks / 多数の小クラックに加え一個の大クラックが形成された銅安定化REBCO超伝導テープにおける電圧端子間距離が臨界電流値に及ぼす影響
Document Type
Journal Article
Source
銅と銅合金 / Journal of Japan Institute of Copper. 2019, 58(1):116
Subject
Copper–stabilized superconducting tape
Crack
Critical current
Modeling analysis
Voltage probe distance
Language
Japanese
ISSN
1347-7234
2435-872X
Abstract
In fabrication and in operation,the copper–stabilized RE (Y, Sm, Dy, Gd, …. ) Ba2Cu3O7–δ superconducting tapes are subjected to thermal, mechanical and electromagnetic stresses/strains. When the superconducting layer is cracked by such stresses, the critical current of the tape is reduced. It has been reported that, in the case where a specifically large crack is formed in addition to many small cracks in the superconducting layer, the critical current value is low when the voltage probe distance in four probe sensing for measurement of voltage–current curve is small, but it becomes higher when the voltage probe distance is larger. In the present work, a simulation study was conducted to describe the variation of critical current value with voltage probe distance under the co–existence of a specifically large crack and many small cracks, by using a model specimen of copper–stabilized superconducting tape, a current shunting model at cracks, and a Monte Carlo method. With the present approach, the experimentally observed increase in critical current value with increasing voltage probe distance was reproduced well. Also, it was shown that the variation of critical current value with position along the longitudinal direction of specimen becomes smaller with increasing voltage probe distance under heterogeneous cracking of the superconducting layer. This result was also in good agreement with the experimentally known feature that the critical current–information is diluted when the voltage probe distance is large.