부산대학교 도서관

The filling of deep-sub micrometer through-holes and trenches with a high aspect ratio by the high vacuum planar magnetron sputter deposition of copper, which even at pressures lower than 10−5 Pa the discharge can be sustained by the applying of a high magnetic field and high target voltage, is investigated. It is found that good filling is achieved in a 1% nitrogen atmosphere at a low sputter pressure of 0.1 Pa, yielding copper films with resistivity of approximately 2 × 10−8 Ωm, equivalent to that prepared by the pure argon sputter.