학술논문

犠牲材料を用いた円筒内側表面に回路を有するMIDデバイス開発
Document Type
Journal Article
Source
Proceedings of JSPE Semestrial Meeting. 2015, :437
Subject
MID
circuit formation
injection molding
sacrificial material
回路形成
射出成形
犠牲材
Language
Japanese

Online Access