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학술논문

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A study of the life prediction analysis technique of solder joint for the SMT connectors of automobiles on the multi-loads / 複合負荷における車載コネクタのはんだ寿命予測解析手法の検討

Document Type

Journal Article

Author

吉田和弘; 土屋隆; 坂田知之; 干強; 戸坂彰彦

Source

Proceedings of Microelectronics Symposium. 2009, :2-2

Subject

Language

Japanese

ISSN

2434-396X

Online Access

Open Access (JSTAGE) Find it@PNU

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