학술논문
The socket is the motherboard, Part 2 - Intel archrival (and Nvidia's BFF) plans to build giant chips that could use kilowatts of power but they won't be as big as Cerebras trillion transistor behemoth
Document Type
Periodical
Author
Source
Techradar. May 11, 2024
Subject
Language
English
Abstract
Byline: Wayne Williams TSMC has announced plans to create giant system-in-packages (SiPs) based on its chip-on-wafer-on-substrate (CoWoS) packaging technology. A few weeks ago, we wrote how Eliyan's NuLink PHY could [...]