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Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders

Document Type

Article

Author

Wiese, S.; Wolter, K.-J.

Source

In Microelectronics Reliability 2004 44(12):1923-1931

Subject

Language

ISSN

0026-2714

Online Access

Full Text (ScienceDirect 종량제) Web of Science JCR 저널정보 Scopus Find it@PNU

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