학술논문
Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn[sbnd]3.0Ag[sbnd]0.5Cu[sbnd]xTiO2 solder joints
Document Type
Article
Author
Source
In Journal of Alloys and Compounds 5 November 2016 684:299-309
Subject
Language
ISSN
0925-8388