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Enhanced size effects on shear performance and fracture behavior of BGA structure micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu joints at low temperatures

Document Type

Article

Author

Li, W.Y.; Chen, F.; Gui, J.; He, S.L.; Qin, H.B.; Huang, J.Q.

Source

In Microelectronics Reliability November 2023 150

Subject

Language

ISSN

0026-2714

Online Access

Full Text (ScienceDirect 종량제) Web of Science JCR 저널정보 Scopus Find it@PNU

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