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Reliability of pressure-free Cu nanoparticle joints for power electronic devices

Document Type

Article

Author

Yamada, Y.; Hasegawa, K.; Ikeda, Y.; Kasagi, Y.; Katagiri, K.; Katou, H.; Watanabe, H.; Takenaka, A.; Nagata, H.; Sekine, N.; Sano, Y.

Source

In Microelectronics Reliability September 2019 100-101

Subject

Language

ISSN

0026-2714

Online Access

Full Text (ScienceDirect 종량제) Web of Science JCR 저널정보 Scopus Find it@PNU

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