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Reliability study of the electroless Ni–P layer against solder alloy

Document Type

Article

Author

Alam, M.O; Chan, Y.C; Hung, K.C

Source

In Microelectronics Reliability 2002 42(7):1065-1073

Subject

Language

ISSN

0026-2714

Online Access

Full Text (ScienceDirect 종량제) Web of Science JCR 저널정보 Scopus Find it@PNU

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