학술논문
Assessment of 20 micron diameter wires for wire bond interconnect technology
Document Type
Conference Paper
Author
Source
In: 2007 Proceedings of the ASME InterPack Conference, IPACK 2007 , 2007 Proceedings of the ASME InterPack Conference, IPACK 2007. (2007 Proceedings of the ASME InterPack Conference, IPACK 2007, 2007, 1:923-930)
Subject
Language
English