학술논문

Interfacial delamination analysis for multi-chip module thin film interconnects

Document Type

Conference Paper

Author

Hu, K.X.; Yeh, C.P.; Wu, X.S.; Wyatt, K.

Source

In: American Society of Mechanical Engineers, EEP, Application of Fracture Mechanics in Electronic Packaging and Materials. (American Society of Mechanical Engineers, EEP, 1995, 11:71-78)

Subject

Language

English

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