학술논문
Integration of a CMOS LSI Chiplet into Micro Flexible Devices for Remote Electrostatic Actuation
Document Type
Conference Paper
Author
Source
In: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2022 , 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2022. (2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2022, 2022)
Subject
Language
English